IC emissions and immunity, PCB debugging, signal integrity, power integrity and EMC pre-compliance tools.
R&D teams need to identify noise sources, coupling paths and immunity weaknesses early. IC-level EMC methods require defined fixtures and calibration, while PCB debugging combines near-field scanning, spectrum analysis, oscilloscope measurements and power-integrity investigation.
◆Integrated circuits and semiconductor devices
◆PCB design and troubleshooting
◆Switch-mode supplies and embedded controllers
◆High-speed digital and mixed-signal electronics
◆Automotive and industrial electronic modules
◆Engineering labs and university R&D
The references below are a technical starting point. Confirm the applicable standard, edition, amendments, national adoption, limits and test levels against the product specification, destination market and certification route.
IEC 61967-1
General conditions and definitions for IC electromagnetic emission measurements.
IEC 61967-2
IC radiated emissions using TEM-cell or related defined methods.
IEC 61967-3
IC radiated emissions using surface scan methods.
IEC 61967-4
IC conducted emissions using defined 1-ohm/150-ohm direct-coupling methods.
IEC 61967-5 / -6
Additional IC emission methods/fixtures; verify current part titles and editions.
IEC 62132-1
General conditions and definitions for IC immunity measurements.
IEC 62132-2
IC immunity using TEM-cell or related methods.
IEC 62132-3
IC immunity using bulk current injection (BCI).
IEC 62132-4
IC immunity using direct RF power injection.
IEC 62132-5
IC immunity using stripline methods.
IEC 61000-4 series
System-level immunity methods for finished equipment/subsystems where relevant.
CISPR 32
Finished multimedia equipment emissions; not a substitute for IC-level methods.
Important: Not every reference applies to every product. Product-specific standards, equipment classification, intended installation and target market determine the final test plan.
Typical methods are mapped to commonly required instrumentation, fixtures and accessories. Final configuration depends on frequency range, power level, severity, uncertainty and the governing method.
IC radiated emissions – TEM/WTEM
Measure IC emissions using defined cell and test-board setup.
TEM/WTEM cell, spectrum analyser/EMI receiver, calibrated path, preamp and test board.
Surface scan – IEC 61967-3
Map near-field emissions across IC/package or PCB.
E/H near-field probes, automated scanner, analyser and preamplifier.
Conducted emissions – IEC 61967-4
Measure emissions using specified direct-coupling fixture.
1-ohm/150-ohm networks as applicable, receiver/analyser and calibrated fixtures.
IC immunity – TEM/WTEM
Expose IC board to controlled RF field.
TEM/WTEM cell, RF generator/amplifier, coupler, power sensor and monitoring.
IC immunity – BCI
Inject RF current onto specified conductors.
RF generator/amplifier, injection/current probes, calibration fixture and power sensor.
Direct RF power injection
Apply RF through defined coupling network/pin arrangement.
RF source/amplifier, coupling network/probe, power meter and fixture.
Stripline immunity
Expose device/board to defined field in stripline.
Stripline fixture, RF generator/amplifier and field/current monitoring.
PCB near-field debugging
Locate switching, clock and coupling noise sources.
Near-field E/H probes, spectrum analyser, preamp and positioning/scanner.
Signal integrity
Inspect edge rate, overshoot, ringing, timing and eye diagrams.
High-bandwidth oscilloscope, active/differential probes and TDR/fixtures.
Power integrity
Measure ripple, droop, transients and PDN noise.
Oscilloscope, low-noise rail probes, current probes, programmable supply/load.
Product EMC pre-compliance
Screen finished product emissions and immunity.
EMI receiver, LISN, antennas, probes, ESD/EFT/surge and RF immunity equipment.
C-PRAV Tech can help configure solutions using the following manufacturers. Product selection is application-dependent and subject to model availability, options, calibration and method requirements.
EMI receivers, spectrum analysers, RF generators, VNAs, oscilloscopes, power analysers, programmable supplies and electronic loads.
EMC immunity systems, ESD, EFT, surge and transient test systems.
LISNs, current probes, near-field probes, antennas, CDNs and EMC pre-compliance accessories.
EMI receivers, LISNs, antennas, CDNs, RF amplifiers and harmonics/flicker solutions.
Oscilloscopes, spectrum analysers, RF generators, VNAs and power supplies.
Oscilloscopes and differential/current probes.
Compact and portable RF spectrum analysers.
Environmental, temperature/humidity, IP, fire/heat and battery test equipment, subject to method suitability.
C-PRAV Tech – Melbourne, Australia
C-PRAV Tech supports EMC, electrical safety, radio, RF exposure, environmental and product compliance activities. Depending on the required method and current laboratory scope, support may include test planning, pre-compliance investigation, formal testing, engineering troubleshooting and equipment demonstrations.
Laboratory: Hallmarc Business Park, A9/2A Westall Road, Springvale VIC 3171, Australia
Contact: sales@c-pravtech.com · +61 3 9087 9383
Talk to C-PRAV about your product, target market, applicable standards and test objectives. We can help identify a practical test approach and suitable instrumentation or test-system configuration.
Technical and accreditation note: This page is general technical guidance, not a declaration of conformity or guarantee of compliance. Verify current editions and applicability with the regulator, standards publisher, certification body or customer. Formal accredited testing is available only where the specific test is included in the laboratory’s current NATA accreditation scope. Equipment examples are indicative; no instrument or package guarantees a pass result.
